PLCC封装IC基板
产品名称:PLCC封装IC基板
产品材质:FR-4,TG170,无卤
生产工艺:
应用行业:PLCC封装IC
产品详情
板厚0.25㎜,镍钯金
无卤亚黑油黑,四层
线路0.05,孔0.1
镍钯金邦定金线工艺

<!--在线客服-->
<script> (function(d, w, c) { if (w[c]) return; var s = d.createElement("script"); w[c] = function() { (w[c].z = w[c].z || []).push(arguments); }; s.async = true; s.src = "https://static.ahc.ink/hecong.js"; if (d.head) d.head.appendChild(s); })(document, window, "_AIHECONG"); _AIHECONG("ini",{ channelId : "cL5X8q" }); </script>